SVENSK STANDARD SS-EN :2019

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1 SVENSK STANDARD SS-EN :2019 Fastställd/Approved: Utgåva/Edition: 1 Språk/Language: engelska/english ICS: ; Flyg- och rymdteknik Produktförsäkran för rymdprodukter Högtillförlitlig lödning för ytmonterad teknik och blandad teknik Space product assurance High-reliability soldering for surfacemount and mixed technology

2 Standarder får världen att fungera SIS (Swedish Standards Institute) är en fristående ideell förening med medlemmar från både privat och offentlig sektor. Vi är en del av det europeiska och globala nätverk som utarbetar internationella standarder. Standarder är dokumenterad kunskap utvecklad av framstående aktörer inom industri, näringsliv och samhälle och befrämjar handel över gränser, bidrar till att processer och produkter blir säkrare samt effektiviserar din verksamhet. Delta och påverka Som medlem i SIS har du möjlighet att påverka framtida standarder inom ditt område på nationell, europeisk och global nivå. Du får samtidigt tillgång till tidig information om utvecklingen inom din bransch. Ta del av det färdiga arbetet Vi erbjuder våra kunder allt som rör standarder och deras tillämpning. Hos oss kan du köpa alla publikationer du behöver allt från enskilda standarder, tekniska rapporter och standardpaket till handböcker och onlinetjänster. Genom vår webbtjänst e-nav får du tillgång till ett lättnavigerat bibliotek där alla standarder som är aktuella för ditt företag finns tillgängliga. Standarder och handböcker är källor till kunskap. Vi säljer dem. Utveckla din kompetens och lyckas bättre i ditt arbete Hos SIS kan du gå öppna eller företagsinterna utbildningar kring innehåll och tillämpning av standarder. Genom vår närhet till den internationella utvecklingen och ISO får du rätt kunskap i rätt tid, direkt från källan. Med vår kunskap om standarders möjligheter hjälper vi våra kunder att skapa verklig nytta och lönsamhet i sina verksamheter. Vill du veta mer om SIS eller hur standarder kan effektivisera din verksamhet är du välkommen in på eller ta kontakt med oss på tel Standards make the world go round SIS (Swedish Standards Institute) is an independent non-profit organisation with members from both the private and public sectors. We are part of the European and global network that draws up international standards. Standards consist of documented knowledge developed by prominent actors within the industry, business world and society. They promote cross-border trade, they help to make processes and products safer and they streamline your organisation. Take part and have influence As a member of SIS you will have the possibility to participate in standardization activities on national, European and global level. The membership in SIS will give you the opportunity to influence future standards and gain access to early stage information about developments within your field. Get to know the finished work We offer our customers everything in connection with standards and their application. You can purchase all the publications you need from us - everything from individual standards, technical reports and standard packages through to manuals and online services. Our web service e-nav gives you access to an easy-to-navigate library where all standards that are relevant to your company are available. Standards and manuals are sources of knowledge. We sell them. Increase understanding and improve perception With SIS you can undergo either shared or in-house training in the content and application of standards. Thanks to our proximity to international development and ISO you receive the right knowledge at the right time, direct from the source. With our knowledge about the potential of standards, we assist our customers in creating tangible benefit and profitability in their organisations. If you want to know more about SIS, or how standards can streamline your organisation, please visit or contact us on phone +46 (0)

3 Europastandarden EN :2019 gäller som svensk standard. Detta dokument innehåller den officiella engelska versionen av EN :2019. The European Standard EN :2019 has the status of a Swedish Standard. This document contains the official version of EN :2019. Copyright / Upphovsrätten till denna produkt tillhör SIS, Swedish Standards Institute, Stockholm, Sverige. Användningen av denna produkt regleras av slutanvändarlicensen som återfinns i denna produkt, se standardens sista sidor. Copyright SIS, Swedish Standards Institute, Stockholm, Sweden. All rights reserved. The use of this product is governed by the end-user licence for this product. You will find the licence in the end of this document. Upplysningar om sakinnehållet i standarden lämnas av SIS, Swedish Standards Institute, telefon Standarder kan beställas hos SIS som även lämnar allmänna upplysningar om svensk och utländsk standard. Information about the content of the standard is available from the Swedish Standards Institute (SIS), telephone Standards may be ordered from SIS, who can also provide general information about Swedish and foreign standards. Har du synpunkter på innehållet i den här standarden, vill du delta i ett kommande revideringsarbete eller vara med och ta fram andra standarder inom området? Gå in på - där hittar du mer information.

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5 EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM ICS ; EN April 2019 English version Space product assurance - High-reliability soldering for surface-mount and mixed technology Assurance produit des projets spatiaux - Soudure haute fiabilité pour technologies à montage de surface et mixte Raumfahrtproduktsicherung - Hochzuverlässiges Löten von Oberflächen-Befestigungen und gemischte Technologien This European Standard was approved by CEN on 5 October CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2019 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN :2019 E

6 Table of contents European Foreword Introduction Scope Normative references Terms, definitions and abbreviated terms Terms from other standards Terms specific to the present standard Abbreviated terms Nomenclature Formal verbs Principles of reliable soldered connections Process identification document (PID) General Purpose Document preparation <<deleted>> Approval SMT contact person <<deleted>> Process identification document updating Preparatory conditions Calibration Facility cleanliness Environmental conditions Precautions against static charges Lighting requirements Equipment and tools Brushes

7 6.6.2 Cutters and Pliers Bending tools Clinching tools Insulation strippers Soldering tools Soldering irons and resistance soldering equipment <<deleted>> Solder baths for degolding and pretinning Soldering machines and equipment General Dynamic wave-solder machines Condensation (vapour phase) reflow machines Hot gas reflow machines <<deleted>> Convection and radiation reflow systems Other equipment for reflow soldering Ancillary equipment General Solder deposition equipment Automatic device placement equipment <<deleted>> Cleanliness testing equipment Magnification aids X-ray inspection equipment Metallographic equipment Material selection General Solder Form Composition Solder paste Maintenance of paste purity Flux Rosin based flux Corrosive acid flux Flux controls for wave-soldering equipment Solvents

8 7.5 Flexible insulation materials Terminals Wires Printed circuit substrates <<deleted>> <<deleted>> <<deleted>> <<deleted>> <<deleted>> <<deleted>> Devices General <<deleted>> Moisture sensitive devices <<deleted>> Adhesives, encapsulants and conformal coatings Preparation for soldering Preparation of devices and terminals Preparation of wires and terminals Preparation of surfaces to be soldered Degolding and pretinning of conductors Alloying of pure tin finish Preparation of solder bit Handling Storage Baking of PCBs and moisture sensitive devices Mounting of devices prior to soldering General requirements Lead bending and cutting requirements Mounting of terminals to PCBs Lead attachment to through holes Mounting of devices to terminals Mounting of through hole connectors to PCBs Surface mount requirements General Stress relief Registration of devices and footprints

9 9.7.4 Lead forming Mounting devices in solder paste Leadless devices Leaded devices <<deleted>> Stacking and bonding of heavy devices Attachment of conductors to terminals, solder cups and cables Soldering to printed circuit boards General <<deleted>> Solder applications to PCBs Wicking Soldering of SMDs General requirements End-capped and end-metallized devices Bottom terminated chip devices Cylindrical and square end-capped devices Castellated chip carrier devices Flat pack and Gull-wing leaded devices with round, rectangular, ribbon leads Devices with J leads Area array devices Devices with ribbon terminals without stress relief L-Shape inwards devices Stacked modules devices with leads protruding vertically from bottom Leaded device with plane termination Moulded magnetics <<deleted>> <<deleted>> <<deleted>> Cleaning of PCB assemblies General Ultrasonic cleaning Monitoring for cleanliness Final inspection General

10 13.2 Acceptance criteria Visual rejection criteria X-ray rejection criterion Warp and twist of populated boards Inspection records Verification procedure General Verification by similarity General Conditions for similarity Verification programme Electrical testing of devices General Vibration and shock Temperature cycling test Microsection Microsection facilities Microsectioning <<deleted>> Special verification testing for hermetic ceramic area array packages <<deleted>> <<deleted>> General Evaluation of capability samples Verification Verification acceptance and rejection criteria Approval of verification Withdrawal of approval status Conditions for delta verification Verification of cleanliness Verification approval procedure Request for verification Technology sample Audit of assembly processing Verification programme Final verification review Certification approval of assembly line

11 15 Quality assurance General Data Nonconformance Calibration Traceability Workmanship standards Inspection Operator and inspector training and certification Quality records <<deleted and moved into clause and Annex I>> Annex A (informative) <<deleted>> Annex B (informative) <<deleted, SMT summary table DRD created in Annex H>> Annex C (informative) <<deleted>> Annex D (informative) Example of an SMT audit report Annex E (informative) Additional information E.1 <<deleted>> E.2 Melting temperatures and choice Annex F (normative) Process Identification Document (PID) - DRD F.1 DRD identification F.1.1 Requirement identification and source document F.1.2 Purpose and objective F.2 Expected response F.2.1 Scope and content F.2.2 Special remarks Annex G (normative) Verification programme report - DRD G.1 DRD identification G.1.1 Requirement identification and source document G.1.2 Purpose and objective G.2 Expected response G.2.1 Scope and content G.2.2 Special remarks Annex H (normative) SMT summary table - DRD

12 H.1 DRD identification H.1.1 Requirement identification and source document H.1.2 Purpose and objective H.2 Expected response H.2.1 Scope and content H.2.2 Special remarks Annex I (informative) Visual and X-ray workmanship standards I.1 Workmanship illustrations for standard SMDs I.1.1 Chip components I.1.2 MELF components I.1.3 Gull-wing leaded devices with round, rectangular, ribbon shape I.1.4 J leaded devices I.1.5 L-shape Inward leaded component I.1.6 LCC devices I.1.7 Miscellaneous soldering defects I.2 Workmanship illustrations for ball grid array devices I.3 Workmanship illustrations for column grid array devices Bibliography Figures Figure 9-1: Exposed element Figure 11-1: Mounting of rectangular and square end-capped and end-metallized devices Figure 11-2: Mounting of bottom terminated chip devices Figure 11-3: Mounting of cylindrical end-capped devices Figure 11-4: Mounting of square end-capped devices Figure 11-5: Mounting of castellated chip carrier devices Figure 11-6: Mounting of gull-wing leaded devices with round, rectangular, ribbon leads Figure 11-7: Mounting of devices with J leads Figure 11-8: <<deleted>> Figure 11-9: Typical ceramic area array showing ball grid array configuration on left and column grid array on right (CBGA & CCGA) Figure 11-10: Typical assembled CCGA device Figure 11-11: Mounting of devices without stress relief Figure 11-12: Mounting of devices with L-shape inwards leads (1 = Toe, 2 = Heel) Figure 11-13: Mounting of stacked modules devices with leads protruding vertically from bottom

13 Figure 11-14: Mounting of leaded devices with leads with plane termination Figure 11-15: <<deleted>> Figure 14-1: Verification programme flow chart (standard flow) Figure 14-2: Verification programme flow chart (electrical testing) Figure 14-3: Verification programme flow chart (AAD) Figure 14-4: <<deleted>> Figure I-1 : Preferred solder (see also Table 11-1) Figure I-2 : Acceptable, maximum solder (see also Table 11-1) Figure I-3 : Acceptable, minimum Solder (see also Table 11-1) Figure I-4 : Unacceptable, excessive solder (see also Table 11-1) Figure I-5 : Unacceptable, poor wetting (see also Table 11-1) Figure I-6 : Unacceptable, excessive tilt (see also Table 11-1) Figure I-7 : Unacceptable, tombstone effect Figure I-8 : Examples of Unacceptable solder joints - (see also Table 11-1) Figure I-9 : Acceptable, terminal wetted along end, face and sides (see also Table 11-1) Figure I-10 : Acceptable, maximum solder joint (see also Table 11-3) Figure I-11 : Not Acceptable, insufficient solder joint (see also Table 11-3) Figure I-12 : Unacceptable overhang Figure I-13 : Examples of Gullwing leads: Acceptable Figure I-14 : Examples of gull-wing device with rectangular lead: Acceptable Figure I-15 : Acceptable, minimum solder joint Figure I-16 : Unacceptable, insufficient heel fillet Figure I-17 : Unacceptable, excessive solder Figure I-18 : Unacceptable, excessive solder Figure I-19 : Preferred solder joint Figure I-20 : Acceptable solder joint Figure I-21 : Unacceptable, excessive solder joint Figure I-22 : Unacceptable, excessive degolding Figure I-23 : Acceptable, preferred solder joint Figure I-24 : LCC General view, acceptable solder joints Figure I-25 : Examples of unacceptable soldering Figure I-26 : Angled-transmission X-radiograph showing solder paste shadow due to partial reflow: Reject Figure I-27 : Micrograph showing Figure I-28 : Perpendicular transmission X-radiograph showing unacceptable defects Figure I-29 : Perpendicular transmission X-radiograph showing non-wetted footprint Figure I-30 : Underside view showing missing column

14 Figure I-31 : CGA mounted on PCB showing columns tilted < 10 : Accept Figure I-32 : X-radiograph of CGA mounted on PCB showing solder bridge: Reject Figure I-33 : X-radiograph of CGA showing solder fillets at base of columns: acceptable Figure I-34 : Micrograph of CGA mounted on PCB, bent column: reject Figure I-35 : Micrograph of CGA mounted on PCB Tables Table 7-1: Chemical composition of spacecraft solders Table 7-2: <<deleted>> Table 11-1: Dimensional and solder fillet for rectangular and square end capped devices Table 11-2: Dimensional and solder fillet for bottom terminated chip devices Table 11-3: Dimensional and solder fillet for cylindrical end-capped devices Table 11-4: Dimensional and solder fillet for square end-capped devices Table 11-5: Dimensional and solder fillet for castellated chip carrier devices Table 11-6: Dimensional and solder fillet for gull-wing leaded devices with round, rectangular, ribbon leads Table 11-7: Dimensional and solder fillet for devices with J leads Table 11-8: Dimensional and solder fillet for area array devices Table 11-9: Dimensional and solder fillet for devices without stress relief Table 11-10: Dimensional and solder fillet for L-shape inwards devices Table 11-11: Dimensional and solder fillet for stacked modules devices with leads protruding vertically from bottom Table 11-12: Dimensional and solder fillet for leaded devices with plane termination Table 14-1: Device type classification Table 14-2: Device microsection location Table 14-3: Critical zone definition per device type and acceptance criteria Table 14-4: Conditions invoking verification Table E-1 : Guide for choice of solder type Table H-1 : Device type preparation and mounting configuration

15 European Foreword This document (EN :2019) has been prepared by Technical Committee CEN-CENELEC/TC 5 Space, the secretariat of which is held by DIN. This standard (EN :2019) originates from ECSS-Q-ST-70-38C Rev.1. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by October 2019, and conflicting national standards shall be withdrawn at the latest by October Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a standardization request given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. 11

16 Introduction This Standard prescribes requirements for electrical connections of leadless and leaded surface mounted devices (SMD) on spacecraft and associated equipment, utilising a range of substrate assemblies and employing solder as the interconnection media. The principal types of SMDs can be gathered in the following families: Rectangular and square end-capped or end-metallized device with rectangular body, leadless chip (see ) e.g. end capped chip resistors and end capped chip capacitors. Cylindrical and square end-capped devices with cylindrical body, leadless chip (see ) e.g. MELF for cylindrical end capped or e.g. D-5A for square end capped Bottom terminated chip device (see ) This type of device has metallised terminations on the bottom side only. e.g. inductors and SMD0.5, SMD1, SMD2, SMD0.2, SMD0.22 e.g. Quad Flat Pack No lead (QFN) 12

17 Castellated chip carrier device (see ) The main device of this type is leadless ceramic chip carrier (LCCC). e.g. LCC6 Flat pack and gull-wing leaded device with round, rectangular, ribbon leads (see ) e.g. small-outline transistor (SOT), small outline package (SO), flat pack and quad flat pack (QFP) and SMD connectors with stress-relief. This family also comprises devices for through-hole mounting that have been reconfigured to surface mounting. Moulded magnetics (see ) e.g interface transformers or specific transformers J leaded device (see ) e.g. ceramic leaded chip carriers (CLCC) and plastic leaded chip carriers (PLCC). 13

18 Area array devices (AAD) (see ) The interconnections between solder footprints on the devices and solder footprints on the PCB consist entirely of solder. The devices have either solder balls (Ball Grid Array - BGA) or solder columns (Column Grid Array - CGA) applied to the solder footprints on the devices prior to mounting on a PCB (normally done by the device manufacturer). The solder balls on the BGAs can consist of either eutectic solder or high temperature solder (5-10 % Sn) whereas the solder columns on the CGAs always consist of high temperature solder. Although BGAs are usually presented as a device family, there exist a large number of BGA devices with wide-ranging properties. The vast majority of BGA devices are non hermetic. Devices with ribbon terminals without stress relief (flat lug leads) (see ) This package has flat leads extending from the sides Device with Inward formed L-shaped leads (see ) e.g. moulded tantalum chip capacitors. Stacked modules devices with leads protruding vertically from bottom (see ) Leaded device with plane termination (see ) e.g. Diode PAcKage (DPAK or TO252) 14

19 1 Scope This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology. The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST Requirements related to printed circuit boards are contained in ECSS-Q-ST , ECSS-Q-ST and ECSS-Q-ST The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 C to +85 C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 C, power transistors) in order to ensure that solder joints do not exceed 85 C. Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration. This Standard does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST