SVENSK STANDARD SS-EN :2015

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1 SVENSK STANDARD SS-EN :2015 Fastställd/Approved: Publicerad/Published: Utgåva/Edition: 1 Språk/Language: engelska/english ICS: ; Flyg- och rymdteknik Manuell lödning av hög tillförlitlighet elektriska anslutningar Space product assurance Manual soldering of high-reliability electrical connections

2 Standarder får världen att fungera SIS (Swedish Standards Institute) är en fristående ideell förening med medlemmar från både privat och offentlig sektor. Vi är en del av det europeiska och globala nätverk som utarbetar internationella standarder. Standarder är dokumenterad kunskap utvecklad av framstående aktörer inom industri, näringsliv och samhälle och befrämjar handel över gränser, bidrar till att processer och produkter blir säkrare samt effektiviserar din verksamhet. Delta och påverka Som medlem i SIS har du möjlighet att påverka framtida standarder inom ditt område på nationell, europeisk och global nivå. Du får samtidigt tillgång till tidig information om utvecklingen inom din bransch. Ta del av det färdiga arbetet Vi erbjuder våra kunder allt som rör standarder och deras tillämpning. Hos oss kan du köpa alla publikationer du behöver allt från enskilda standarder, tekniska rapporter och standardpaket till handböcker och onlinetjänster. Genom vår webbtjänst e-nav får du tillgång till ett lättnavigerat bibliotek där alla standarder som är aktuella för ditt företag finns tillgängliga. Standarder och handböcker är källor till kunskap. Vi säljer dem. Utveckla din kompetens och lyckas bättre i ditt arbete Hos SIS kan du gå öppna eller företagsinterna utbildningar kring innehåll och tillämpning av standarder. Genom vår närhet till den internationella utvecklingen och ISO får du rätt kunskap i rätt tid, direkt från källan. Med vår kunskap om standarders möjligheter hjälper vi våra kunder att skapa verklig nytta och lönsamhet i sina verksamheter. Vill du veta mer om SIS eller hur standarder kan effektivisera din verksamhet är du välkommen in på eller ta kontakt med oss på tel Standards make the world go round SIS (Swedish Standards Institute) is an independent non-profit organisation with members from both the private and public sectors. We are part of the European and global network that draws up international standards. Standards consist of documented knowledge developed by prominent actors within the industry, business world and society. They promote cross-border trade, they help to make processes and products safer and they streamline your organisation. Take part and have influence As a member of SIS you will have the possibility to participate in standardization activities on national, European and global level. The membership in SIS will give you the opportunity to influence future standards and gain access to early stage information about developments within your field. Get to know the finished work We offer our customers everything in connection with standards and their application. You can purchase all the publications you need from us - everything from individual standards, technical reports and standard packages through to manuals and online services. Our web service e-nav gives you access to an easy-to-navigate library where all standards that are relevant to your company are available. Standards and manuals are sources of knowledge. We sell them. Increase understanding and improve perception With SIS you can undergo either shared or in-house training in the content and application of standards. Thanks to our proximity to international development and ISO you receive the right knowledge at the right time, direct from the source. With our knowledge about the potential of standards, we assist our customers in creating tangible benefit and profitability in their organisations. If you want to know more about SIS, or how standards can streamline your organisation, please visit or contact us on phone +46 (0)

3 Europastandarden EN :2015 gäller som svensk standard. Detta dokument innehåller den officiella engelska versionen av EN :2015. The European Standard EN :2015 has the status of a Swedish Standard. This document contains the official version of EN :2015. Copyright / Upphovsrätten till denna produkt tillhör SIS, Swedish Standards Institute, Stockholm, Sverige. Användningen av denna produkt regleras av slutanvändarlicensen som återfinns i denna produkt, se standardens sista sidor. Copyright SIS, Swedish Standards Institute, Stockholm, Sweden. All rights reserved. The use of this product is governed by the end-user licence for this product. You will find the licence in the end of this document. Upplysningar om sakinnehållet i standarden lämnas av SIS, Swedish Standards Institute, telefon Standarder kan beställas hos SIS Förlag AB som även lämnar allmänna upplysningar om svensk och utländsk standard. Information about the content of the standard is available from the Swedish Standards Institute (SIS), telephone Standards may be ordered from SIS Förlag AB, who can also provide general information about Swedish and foreign standards. Har du synpunkter på innehållet i den här standarden, vill du delta i ett kommande revideringsarbete eller vara med och ta fram andra standarder inom området? Gå in på - där hittar du mer information.

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5 EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM EN January 2015 ICS ; English version Space product assurance - Manual soldering of high-reliability electrical connections Assurance produit des projets spatiaux - Soudage manuel des connexions électriques à fiabilité élevée Raumfahrtproduktsicherung - Manuelles Löten von hochzuverlässigen elektrischen Verbindungen This European Standard was approved by CEN on 18 October CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN :2015 E

6 Table of contents Foreword... 9 Introduction Scope Normative references Terms, definitions and abbreviated terms Terms from other standards Terms specific to the present standard Abbreviated terms Principles of reliable soldered connections Preparatory conditions Calibration Facility cleanliness Environmental conditions Lighting requirements Precautions against static discharges General Precautions against ESD during manufacturing Protective Packaging and ESD Protection Packing and filler materials Equipment and tools General Brushes Cutters and pliers Bending tools Clinching tools Insulation strippers Soldering irons and resistance soldering equipment Soldering tools

7 6 Materials selection General Solder Form Composition Flux Rosin-based fluxes INH1 corrosive acid flux Application of flux Solvents Flexible insulation materials Terminals Materials Tin-, silver- and gold-plated terminals Shape of terminals Wires PCBs Boards Gold finish on conductors Component lead finishes Adhesives (staking compounds and heat sinking), encapsulants and conformal coatings Preparation for soldering General Tools Components Preparation of conductors, terminals and solder cups Insulation removal Surfaces to be soldered De-golding of gold-plated leads and terminals Constraints on degolding and pretinning methods Pretinning of stranded wires Pre-tinning of component leads and solid-wire conductors Preparation of the soldering bit Fit Maintenance Plated bits

8 7.3.4 Tip in operation Maintenance of resistance-type soldering electrodes Handling (work station) Storage (work station) Components PCBs Materials requiring segregation Preparation of PCBs for soldering Process Demoisturization methods Storage of prepared PCBs Mounting of components General requirements Introduction Heavy components Metal-case components Glass-encased components Stress relief of components with bendable leads Stress relief of components with non-bendable leads Reinforced plated-through holes Lead and conductor cutting Solid hook-up wire Location Conformal coating, cementing and encapsulation Lead bending requirements General Conductors terminating on both sides of a non-plated-through hole Mounting of terminals to PCBs Lead attachment to PCBs General Clinched leads Stud leads Lapped round leads Lapped ribbon leads Mounting of components to terminals Mounting of connectors to PCBs Attachment of conductors to terminals, solder cups and cables

9 9.1 General Conductors Terminals Wire termination Breakouts from cables Insulation clearance Solid hook-up wire Stress relief Turret and straight-pin terminals Side route Bottom route Bifurcated terminals General Bottom route Side route Top route Combination of top and bottom routes Combination of side and bottom routes Hook terminals Pierced terminals Solder cups (connector type) Insulation sleeving Wire and cable interconnections General Preparation of wires Preparation of shielded wires and cables Pre-assembly Soldering procedures Cleaning Inspection Workmanship Sleeving of interconnections Connection of stranded wires to PCBs Soldering to terminals and PCBs General Securing conductors Thermal shunts

10 High-voltage connections Solder application to terminals Soldering of swaged terminals onto PCBs Soldering of conductors onto terminals (except cup terminals) Soldering of conductors onto cup terminals Solder application to PCBs Solder coverage Solder fillets Soldering of component leads to plated-through holes Solder application Wicking Solder rework Repair and modification Cleaning of PCB assemblies General Ultrasonic cleaning Monitoring for cleanliness Cleanliness testing Testing frequency Test limits Test method Final inspection General Acceptance criteria Visual rejection criteria Verification procedure General Vibration Temperature cycling Microsection Quality assurance General Data Nonconformance Calibration Traceability

11 14.6 Workmanship standards Inspection Operator and inspector training and certification Workmanship standards Soldered clinched terminals Soldered stud terminals Soldered turret terminals Solder turret terminals Soldered bifurcated terminals Soldered hook terminals Soldered cup terminals Soldered wire to shielded cable interconnections Annex A (normative) Report on manual soldering of high-reliability electrical connections - DRD Annex B (informative) Solder melting temperatures and choice Bibliography Figures Figure 5-1: Profiles of correct and incorrect cutters for trimming leads Figure 5-2 Examples of non-approved types of mechanical strippers Figure 8-1: Assembly of underfilled TO-39 and TO-59, and adhesively staked CKR Figure 8-2: Methods for incorporating stress relief with components having bendable leads Figure 8-3: Methods for attaching wire extensions to non-bendable leads Figure 8-4: Minimum lead bend Figure 8-5: Leads with solder termination on both sides Figure 8-6: Types of terminal swaging Figure 8-7: Clinched-lead terminations - unsupported holes Figure 8-8: Clinched lead terminations - plated through-holes Figure 8-9: Stud terminations Figure 8-10: Methods of through-hole lapped termination Figure 8-11: Method of stress relieving parts attached to terminals Figure 9-1: Side- and bottom-route connections to turret terminals Figure 9-2: Bottom-route connections to bifurcated terminal Figure 9-3: Side-route connection to bifurcated terminal Figure 9-4: Top-route connection to bifurcated terminal

12 Figure 9-5: Connections to hook terminals Figure 9-6: Connections to pierced terminals Figure 9-7: Connections to solder cups (connector type) Figure 9-8: Methods for securing wires Figure 9-9: Connection of stranded wires to PCBs Figure 10-1: High voltage connection Figure 10-2:Minimum acceptable wetting on component side Figure 15-1:Soldered clinched terminals Figure 15-2: Soldered stud terminals Figure 15-3: Soldered turret terminals with twin conductors Figure 15-4: Soldered turret terminals with single conductors Figure 15-5: Soldered bifurcated terminals Figure 15-6 Soldered hook terminals Figure 15-7: Soldered cup terminals Figure 15-8: Hand-soldered wire to shielded cable interconnections Figure 15-9: Hand-soldered wire to shielded wire interconnections Figure 15-10: Hand-soldered wire interconnections - details of defects Tables Table 6-1: Chemical composition of spacecraft solders Table 6-2: Fluxes Table 7-1: Clearances for insulation Table 7-2: Solder baths for degolding and pretinning Table 9-1: Dimensions for Figure Table 13-1: Sine survey Table 13-2: Minimum severity for sine vibration testing Table 13-3: Minimum severity for random vibration testing for all applications except launchers Table 13-4: Minimum severity for random vibration testing for launcher Table B-1 : Guide to choice of solder types

13 Foreword This document (EN :2015) has been prepared by Technical Committee CEN/CLC/TC 5 Space, the secretariat of which is held by DIN. This standard (EN :2015) originates from ECSS-Q-ST-70-08C. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by July 2015, and conflicting national standards shall be withdrawn at the latest by July Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. 9

14 Introduction The main part of this Standard is based on recommendations from the National Aeronautics and Space Administration and European soldering technology experts. Modifications have been incorporated into the text to provide for the specific requirement of low outgassing electrical systems which are required by scientific and application satellites. Other additions have been made in the light of recent technological advances and the results of verification test programmes. The methods and workmanship contained in this document are considered to be fully approved for normal spacecraft requirements. 10

15 1 Scope This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, highreliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST Requirements related to printed circuit boards are contained in ECSS-Q-ST and ECSS-Q-ST Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of 55 C to +85 C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 C, power transistors) in order to ensure that solder joints do not exceed 85 C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST

16 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this ECSS Standard. For dated references, subsequent amendments to, or revision of any of these publications do not apply, However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the more recent editions of the normative documents indicated below. For undated references, the latest edition of the publication referred to applies. EN reference Reference in text Title EN ECSS-S-ST ECSS system - Glossary of terms EN ECSS-Q-ST Space product assurance - Nonconformance control system EN ECSS-Q-ST-20 Space product assurance - Quality assurance EN ECSS-Q-ST Space product assurance - Thermal vacuum outgassing test for the screening of space materials EN ECSS-Q-ST Space product assurance - Qualification of printed circuit boards EN ECSS-Q-ST Space product assurance - Procurement of printed circuit boards EN ECSS-Q-ST Space product assurance - Repair and modification of printed circuit board assemblies for space use EN ECSS-Q-ST Space product assurance - Data for selection of space materials and processes ESCC EN EN MIL-STD-883 Rev.G Requirements for lead materials and finishes for components for space application Protection of electronic devices from electrostatic phenomena - General requirements Protection of electronic devices from electrostatic phenomena User guide Test methods and procedures for microelectronics 12

17 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and definitions from ECSS-ST apply. For the purpose of this Standard, the following terms from ECSS-Q-ST apply: repair rework 3.2 Terms specific to the present standard approval authority entity that reviews and accepts the verification programme, evaluating the test results and grants the final approval base laminate see substrate bifurcated (split) terminal terminal containing a slot or split in which wires or leads are placed before soldering bit removable heat store of a soldering iron blister delamination in a distinct local area or areas bridging build-up of solder or conformal coating between parts, component leads or base substrate forming an elevated path NOTE See fillet. 13

18 3.2.7 clinched-lead termination conductor or component lead which passes through a printed circuit board and is then bent to make contact with the printed circuit board pad NOTE The clinched portion is not forced to lie flat on the pad and some innate spring back is desirable before this form of termination is soldered cold flow movement of insulation, for example Teflon (PTFE), caused by pressure cold solder joint joint in which the solder has a blocky, wrinkled or piled-up appearance and shows signs of improper flow or wetting action NOTE It can appear either shiny or dull, but not granular. The joint normally has abrupt lines of demarcation rather than a smooth, continuing fillet between the solder and the surfaces being joined. These lines are caused by either insufficient application of heat or the failure of an area of the surfaces being joined to reach soldering temperature component device which performs an electronic, electrical or electromechanical function and consists of one or more elements joined together and which cannot normally be disassembled without destruction NOTE 1 The terms component and part can be interchanged. NOTE 2 Transistors, integrated circuits, hybrids, capacitors component lead solid wire which extends from and serves as a connection to a component conductor lead or wire, solid or stranded, or printed circuit patch serving as an electrical interconnection between terminations conformal coating thin protective coating which conforms to the configuration of the covered assembly connection electrical termination 14

19 contact angle angle enclosed between half-planes, tangent to a liquid surface and a solidliquid interface at their intersection NOTE In particular, the contact angle of liquid solder in contact with a solid metal surface. An approximate value for this can be determined by shadow projection or other means, by measuring after the solder has solidified. The contact angle is always the angle inside the liquid contamination particles, liquids, gases, materials and micro-organisms which by their presence can disturb the performance of an item corrosion deterioration of a metal by chemical or electrochemical reaction with its environment cracked solder joint soldered connection which has fractured or broken within the solder dewetting condition in a soldered area in which the liquid solder has not adhered intimately, characterized by an abrupt boundary between solder and conductor, or solder and terminal/termination area NOTE This is often seen as a dull surface with islands of thicker shiny solder disturbed solder joint unsatisfactory connection resulting from relative motion between the conductor and termination during solidification of the solder electrical connection conductive connection in electrical or electronic circuits eutectic alloy alloy of two or more metals that has one distinct melting point NOTE One eutectic solder is a tin-lead alloy containing 63 % Sn and 37 % Pb which melts at 183 C fillet smooth concave build-up of material between two surfaces NOTE Example: A fillet of solder between a component lead and a solder pad or terminal, or a fillet of conformal coating material between a component and printed circuit board 15